Integrated Device Technologies, Inc.
Hillsboro, Oregon
The IDT project consisted of a 96,000 square foot two-story office building attached to a 96,000 square foot silicon wafer fabrication building. The project also had three buildings and a mechanical platform containing support equipment totaling 40,700 square feet and four pipe support bridges. All the buildings were concrete tilt-up structures with structural steel and open-web joist framing. The fab building tilt-up panels were 55-feet tall. This was a fast-track project and was completed (start of design to building dry-in) in six months with the facility was producing product within sixteen months of start of design.







